Plasma specstrocopy plays a vital role in Semiconductor processing, despite having a fingernail-sized form factor, a typical semiconductor chip contains billions of electrical components, including transistors, diodes, resistors, capacitors, and more.

Step 1: Building and protecting the silicon wafer

Microscopic circuit designs are constructed on several layers of different materials, and this process is done at least a few hundred times in order to create a chip. Like the "canvas" of the chip, the wafer. It is a narrow, shiny disc that was carved with certain dimensions. In this step, the surfaces will be covered by the  smooth silicon dioxide coating by a thermal oxidation procedure . This shields the disc's surface from chemical contaminants that might change conductivity and impair the electrical qualities of the circuit.

Figure 1: Semiconductor processing

Step 2: Surface Cleaning

Plasma cleaning is a cleaning technology that decomposes and vaporizes organic substances such as oil adhering to the surface of the substrate with plasma. In addition to being a dry and clean method that does not use water or cleaning solutions, it also provides a high level of cleaning that leaves no residue. Cleaning processes often use oxygen plasma. Precise control of the plasma gas in the chamber is critical so processes perform as expected, for all the individual chips, across the entire diameter of the wafer. Plasma-based surface cleaning may also become an enabling technology for cluster processing in the semiconductor industry.

Figure 2: Cleaning the surface by using Plasma Spectroscopy

Step 3: The etching process

Etching is the process of carving grooves and patterns on the surface of a substrate. Plasma etching is a process used to create patterns on semiconductor surfaces. In this process, a plasma is used to selectively remove material from the surface of the semiconductor. Plasma measurement can be used to monitor the plasma parameters such as plasma density, ion energy, and ion flux, which are critical for controlling the etching process and ensuring the desired pattern is created.

Step 4: The thin-film process

Thin films are formed on wafers to be used as materials for wiring and transistors. At this point, there are no circuits or other patterns in the thin film. The thin-film deposition is mainly done by PVD (Physical Vapor Deposition) and Plasma CVD techniques. PVD includes techniques such as sputtering and vacuum deposition. Application of Plasma Measurement in Sputtering will bring the deep knowledge related the definition of Sputtering as well as the reactive sputtering, one of most practical variations in sputtering process.

Step 5: The metal interconnect process

To guarantee that signals may travel to the appropriate locations, the metal interconnect technique connects the electronic components using metal circuits. Plasma deposition is a process used to deposit thin films of material onto the surface of semiconductor devices. Plasma measurement can be used to monitor the plasma parameters such as gas composition, pressure, and power, which are critical for controlling the deposition process and ensuring the desired film properties are achieved.

Step 6: Testing and packaging  

A series of tests, including the electrical die sorting (EDS) test, will be performed on semiconductor chips. Every chip that leaves the facility is checked by the EDS procedure to ensure it complies with the manufacturer's requirements. Along with providing protection from the elements, the packaging also provides protection against vibration, impact, humidity, and chemicals. It is must to test the chip's functionality after packaging. Chips are put to a variety of voltage, electrical signal, and temperature tests. In this approach, we may evaluate the electrical and functional properties of the components as well as their performance to look for any flaws.

Spectrometers are used for plasma monitoring in semiconductor processing

Through the eight-step for semiconductor fabriction mentioned above, it is clear that plasma monitoring is really necessary in this process when it is used in etching, deposition, cleaning and diagnostic step. By the advantages, Real-time measurements, Flexible setups for different processes, High stability for reliable performance in process environments, These product lines of Ocean Optics (ocean Insight) can support to optimize the output as well as the quality of semiconductors: Ocean HR4PRO , Ocean SR as well as Ocean ST, QE Pro-Raman. With the specifications such as High resolution and thermal stability with rapid data acquisition speed, fast acquisition speed and high SNR, as well as High sensitivity will be expected to meet the needs of customer in semiconductor processing.

Besides, We also provide a plasma measurement package: Bundle-HR-Plasma, Bundle-Flame-Plasma which includes:

• Spectrometer: HR4PRO spectrometer, FLAME spectrometer
• Fibers and Probes: Fiber with specifications tailored to the measurement environment to be used
• Sampling Accessories : 74 Collimating Lens
• Software: Operating Software